Introduction | Certificates | Keypoint | Application | Spec | Property | Details in Catalog
LEXFLEX 2L FCCL adhesiveless flexible copper clad laminates. It is also used as raw material of components where flexibility of various electronic products like mobile phones, LCD monitors and HDDs, which are frequently used in our daily life, is required.
CERTIFICATES
LEXFLEX 2L FCCL Certificate
Our FCCL already certificate by UL. Our file number could be search under UL Database (click to QMTS2.E466949). Also it is RoHS ready! More confident for customer choose LEXFLEX 2L FCCL as partner.
LEXFLEX 2L FCCL is a sputter type with two-layers of FCCL, it is an electronic material required to make a product lightweight, and is fine-pitch with industrial development of electronic components. After formulating conductive layer with sputtering on polyamide film, this product passes plating process and offers a various copper thickness (2~8㎛) that meets customers’ options.
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Enable Design Density. |
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Thinner cross-sections than laminates with adhesives, allowing for more design freedom in flexing applications. |
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No adhesive to remove from laser-cleared openings or plated through holes. |
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Improves assembly success with higher temperature operation and soldering. |
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Reduces a potential source of electromigration. |
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Improved flex life design. |
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Meet the specifications of IPC & UL. |
Applications for LEXFLEX 2L- Single Sided laminates:
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High density flex circuits |
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PDP driver IC packaging |
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Traditional flex circuits |
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Chip on film (COF) substrate |
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Tape automatic bonding (TAB) |
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Chip scale packaging (CSP) |
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Ball grid array (BGA) |
 
Specification of LEXFLEX SD
Model |
A Side Cu Thickness |
PI Thickness |
B Side Cu Thickness |
Core Diameter |
SS-1025 |
10㎛ |
25㎛ |
- |
3" / 6" |
Property of LEXFLEX SD
Property
|
Unit |
Value |
Peel Strength
|
As Received |
Kgf/cm |
≥ 1.3 |
| After Soilder |
≥ 1.1 |
Dimensional
Stability
|
MD |
% |
± 0.04 |
| TD |
Solder Float (288°C)
IPC-TM-650.2.4.13
|
sec |
≥10 |
Dielectric Constant
(Dk @ 1GHz)
|
|
3.8 |
Tensile Strength
IPC-TM-650.2.4.4 |
MPa |
≥ 480 |
Tensile Modulus
IPC-TM-650.2.4.4 |
Gpa |
25 |
Z Axis Elongation
50C-260C
|
% |
2.3 |
Volume Resistivity
IPC-TM-650.2.5.17
|
MΩ·cm |
1012 |
Z-CTE (Before Tg)
IPC-TM-650.2.4.41
|
ppm/°C |
35 |
Moisture Absorption (100°C RH)
E-24/50+D-24/23
|
% |
0.15 |
| Flammability |
UL- 94 |
V - 0 |
|
